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Buckling Sensitivity and Deformation of Lines in Integrated Circuits

Peter Woytowitz (Lam Research Corp.), Keerthi Gowdaru (Lam Research Corp.)

Mechanics of Thin Films and Multilayered Structures

Tue 10:45 - 12:15

Salomon 203

Buckling (referred to as line bending in semiconductor electronics manufacturing) is an important design consideration in the fabrication of advanced integrated circuit devices. There are electrical advantages to having a high aspect ratio for the lines in many applications. However, line bending or buckling, is not acceptable for numerous reasons. Since the as deposited blanket films often exhibit compressive intrinsic (residual) stresses, these high-aspect line features are prone to self-induced buckling (see Figure 1). In this paper we study several effects of the material properties (Young’s modulus and intrinsic stress levels) and geometric properties (aspect ratio and line edge roughness) on the predicted buckling behavior of the line. Explanation of the basic phenomenon is accomplished thru analysis using classical buckling formula for blade type stiffeners. More detailed and advanced explanation of the behavior is presented through use of numerical simulation of the process.