Interfacial failure and adhesion between a suspended microscopic polymeric film and its metallic substrate
Wanliang Shan (Carnegie Mellon University), Jing Du (MAE, Princeton University), Wole Soboyejo (MAE, Princeton University)
Mechanics of Thin Films and Multilayered Structures
Wed 9:00 - 10:30
Salomon 203
Thin polymeric films have been widely used as coating in microelectronics systems and medical devices. Recently a new generation of medical devices uses suspended polymeric films instead of conformal ones as coating. However, studies on the mechanical behavior of such systems are still lacking. This work presents experimental and computational results on the adhesion and interfacial failure between a suspended microscopic polymeric film and its metallic substrate. A new microscale experimental technique is developed to measure the push-out forces to induce interfacial failure within the coating-substrate composite. Atomic Force Microscopy is then used to characterize the adhesion of the pair on the nanoscale. Finally, based on the AFM results, Finite Element Analysis is conducted to simulate the interfacial failure process during push-out. Good agreement between the numerical and experimental results is found. These findings provide insights into the processing and use of such coating-substrate composite in medical devices and others containing similar structure.