The Center for Advanced Materials Research is an independent academic unit at Brown University

Central Facilities

Microelectronics Facility	Electron Microscope Facility	Joint Engineering Physics Instrument Group
MF	EMF	JEPIS

Equipment		Contacts
Access	Electron Microscope Facility	Research Highlights
Policy & Rates		Research Highlights

The laboratory instrumentation consists of:

Transmission Electron Microscopes,
Scanning Electron Microscopes,
Beam blanking and e-beam writing accessories for high resolution lithography,
Sample preparation facilities,
Image processing facilities.

Optical and atomic force microscopes are also available. Features of shared MRSEC microscopes are outlined below.

Click here for current rates for outside MRSECs.

JEOL JEM-2010 TEM: The JEM 2010 is a 200 kV, high-resolution/analytical hybrid insrument, capable of .19 nm point-to-point resolution. It is equipped with an x-ray spectrometer, a parallel electron energy loss spectrometer (PEELS), a high-resolution, CCD camera system, and a high-resolution TV-rate camera. A high-temperature single-tilt holder (1300 C maximum) is used in situ experimental observations.

Phillips EM-420 TEM/STEM: The EM-420 is a 120 kV analytical TEM, equipped with an x-ray spectrometer, and energy loss spectrometer, and a low-temperature double tilt holder. This instrument has a goniometer with a tilt range of +/- 60 degrees. This is invaluable for defect analysis and structural analysis by convergent beam diffraction.

LEO 1530: The LEO 1530 is a high-resolution SEM equipped with a field emission source. Resolution of 1.5 nm is obtainable. This instrument has excellent capability for low-voltage imaging, which is particularly important for examining insulating materials.

JEOL JSM 845: The JSM-845 has a resolution of 4.0 nm and a chamber that can accept 6'' wafers. It is equipped with an energy dispersive x-ray spectrometer for compositional analysis and an EBSP (electron backscatter pattern) system for orientation imaging. EBSP provides rapid crystallographic orientation of all grains on the surface of the specimen.

Both scanning electron microscopes are equipped with e-beam writing capabilities for high-resolution lithography.

Sample Preparation: Extensive facilities are available for preparing TEM specimens of metals, ceramics, and semiconductors. A partial list of equipment includes: jet polisher, ion mills, polishing benches, dimpler, high and low speed diamond saws, and carbon evaporator.

Image Processing: Image processing capabilities currently include: a DEC 5000 workstation, a Macintosh IIfx interfaced with the JSM 2010, and an IBM PC with a network link to a DEC file server. Software includes the JCPDS diffraction files and programs for diffraction analysis. The DEC station also features software for image processing simulation.

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