Job Description # 2: Candidate
will be a member of a mechanics core competency team based in Chandler
(Phoenix), Arizona to influence the mechanical design, materials selection and
structural integrity & reliability of IC packages and other associated
components under manufacturing, test and usage conditions. . Team supports the
technology development of Intel's next generation silicon packaging
technologies for all market segments including CPU's, Chipsets, Telecom &
Wireless products.
Candidate must be able to conduct numerical analyses and
analyze validation experiments that influence the required physical
characteristics of integrated circuit packages. An PhD or MS degree in
Mechanical Engineering, Applied Mechanics or a related discipline, with 0-2
years with a strong background in mechanical engineering and materials
response analysis. Candidate should have a good understanding of solid
mechanics and knowledge of linear/non-linear finite element analysis; response
to static and/or dynamic loadings; numerical tools/techniques in damage
mechanics and fracture. Exposure / knowledge to IC packaging or PC-Boards a
definite plus. Candidate must be willing to work in a cross-cultural team
environment with good communication (written and presentation) skills.
Interaction will also be required with teams in Chandler (AZ), Malaysia and
the Philippines.