Publications

Found 369 results

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2011
Cochran, R., C. Hankendi, A. K. Coskun, and S. Reda, "Pack & Cap: adaptive DVFS and thread packing under power caps", Proceedings of the 44th Annual IEEE/ACM International Symposium on Microarchitecture, New York, NY, USA, ACM, pp. 175–185, 2011.
Reda, S., "Thermal and power characterization of real computing devices", Emerging and Selected Topics in Circuits and Systems, IEEE Journal on, vol. 1, no. 2: IEEE, pp. 76–87, 2011.
Ferri, C., A. Marongiu, B. Lipton, T. Moreshet, I. R. Bahar, M. Herlihy, and L. Benini, "SoC-TM: Integrated HW/SW support for transactional memory programming on embedded MPSoCs", Proceedings of the 7th IEEE/ACM/IFIP International Conference on Hardware/Software Codesign and System Synthesis, New York, NY, USA, ACM, pp. 39–48, 2011.
Do, H., and H. F. Silverman, "A robust sound-source separation algorithm for an adverse environment that combines MVDR-PHAT with the CASA framework", Applications of Signal Processing to Audio and Acoustics (WASPAA), 2011 IEEE Workshop on, pp. 273-276, 2011.
Nowroz, A. N., and S. Reda, "Thermal and power characterization of field-programmable gate arrays", Proceedings of the 19th ACM/SIGDA international symposium on Field programmable gate arrays, New York, NY, USA, ACM, pp. 111–114, 2011.
2010
Alves, N., A. Buben, K. Nepal, J. Dworak, and I. R. Bahar, "A Cost Effective Approach for Online Error Detection Using Invariant Relationships", IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 29, no. 5, pp. 788-801, May, 2010.
Reda, S., and S. R. Nassif, "Accurate spatial estimation and decomposition techniques for variability characterization", Semiconductor Manufacturing, IEEE Transactions on, vol. 23, no. 3: IEEE, pp. 345–357, 2010.
Cochran, R., and S. Reda, "Consistent runtime thermal prediction and control through workload phase detection", Proceedings of the 47th Design Automation Conference, New York, NY, USA, ACM, pp. 62–67, 2010.
Khan, N. H., S. Reda, and S. M. N. Hassoun, "Early Estimation of TSV Area for Power Delivery in 3D Integrated Circuits", 3D Systems Integration Conference (3DIC), 2010 IEEE International: IEEE, 2010.
Ferri, C., S. Wood, T. Moreshet, I. R. Bahar, and M. Herlihy, "Energy and Throughput Efficient Transactional Memory for Embedded Multicore Systems", HiPEAC '10: Proceedings of the International Conference on High-Performance Embedded Architectures and Compilers, vol. 5952: Springer, pp. 50–65, 2010.
Cochran, R., A. N. Nowroz, and S. Reda, "Post-silicon power characterization using thermal infrared emissions", Proceedings of the 16th ACM/IEEE international symposium on Low power electronics and design, New York, NY, USA, ACM, pp. 331–336, 2010.
Nowroz, A. N., R. Cochran, and S. Reda, "Thermal monitoring of real processors: techniques for sensor allocation and full characterization", Proceedings of the 47th Design Automation Conference, New York, NY, USA, ACM, pp. 56–61, 2010.
Ferri, C., S. Wood, T. Moreshet, I. R. Bahar, and M. Herlihy, "Embedded-TM: Energy and Complexity-Effective Hardware Transactional Memory for Embedded Multicore Systems", Journal of Parallel and Distributed Computing, vol. 70, no. 10, Orlando, FL, USA, Academic Press, pp. 1042–1052, 2010.
Levi, A., and H. F. Silverman, "An alternate approach to adaptive beamforming using SRP-PHAT", Acoustics Speech and Signal Processing (ICASSP), 2010 IEEE International Conference on, pp. 2726-2729, 2010.
Qiu, J., S. Reda, and S. Hassoun, "Fast, accurate a priori routing delay estimation", Proceedings of the 12th ACM/IEEE international workshop on System level interconnect prediction, New York, NY, USA, ACM, pp. 77–82, 2010.
Alves, N., K. Nepal, J. Dworak, and I. R. Bahar, "Improving the testability and reliability of sequential circuits with invariant logic", Proceedings of the 20th symposium on Great lakes symposium on VLSI, New York, NY, USA, ACM, pp. 131–134, 2010.
Levi, A., and H. Silverman, "A Robust Method to Extract Talker Azimuth Orientation Using a Large-Aperture Microphone Array", Audio, Speech, and Language Processing, IEEE Transactions on, vol. 18, no. 2, pp. 277-285, 2010.
Do, H., and H. F. Silverman, "SRP-PHAT methods of locating simultaneous multiple talkers using a frame of microphone array data", Acoustics Speech and Signal Processing (ICASSP), 2010 IEEE International Conference on, pp. 125-128, 2010.
2009
Ferri, C., M. Loghi, M. Poncino, and I. R. Bahar, "Energy-Optimal Synchronization Primitives for Single-Chip Multi-Processors", ACM Great Lakes Symposium on VLSI, pp. 141-144, May, 2009.
Sabou, F. C., D. Kazazis, I. R. Bahar, J. Mundy, W. R. Patterson, and A. Zaslavsky, "Markov Chain Analysis of Thermally Induced Soft Errors in Subthreshold Nanoscale CMOS Circuits", IEEE Transactions on Device and Materials Reliability, vol. 9, no. 3, pp. 494–504, August, 2009.
Reda, S., A. Si, and I. R. Bahar, "Reducing the Leakage and Timing Variability of 2D ICs using 3D ICs", ACM/IEEE International Symposium on Low Power Electronics and Design, pp. 283-286, August, 2009.
Reda, S., and S. R. Nassif, "Analyzing the impact of process variations on parametric measurements: novel models and applications", Proceedings of the Conference on Design, Automation and Test in Europe: European Design and Automation Association, pp. 375–380, 2009.
Le, R., S. Reda, and I. R. Bahar, "High-performance, cost-effective heterogeneous 3D FPGA architectures", Proceedings of the ACM/SIGDA international symposium on Field programmable gate arrays, New York, NY, USA, ACM, pp. 286–286, 2009.
Reda, S., A. Si, and I. R. Bahar, "Reducing the leakage and timing variability of 2D ICs using 3D ICs", Proceedings of the 14th ACM/IEEE international symposium on Low power electronics and design, New York, NY, USA, ACM, pp. 283–286, 2009.
Cochran, R., and S. Reda, "Spectral techniques for high-resolution thermal characterization with limited sensor data", Proceedings of the 46th Annual Design Automation Conference, New York, NY, USA, ACM, pp. 478–483, 2009.